Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

USPAE to Springboard U.S. Technology Forward

04/30/2024 | Marcy LaRont, PCB007 Magazine
The U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.

Orbex Secures £16.7m Investment for Rocket ‘Ramp Up’ Period

04/24/2024 | Orbex
The UK spaceflight company Orbex has received £16.7m from six backers in an update to its Series C funding round.

Big Win for Defense Production Act Budget Allocation in FY24 Budget

04/23/2024 | I-Connect007 Editorial Team
One year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.

SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity

04/11/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States:

Intel, Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act

03/20/2024 | Intel
The Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in